People from all over the world will be present at the3rd Annual Photonic Integration Conferencewhich will take place at High Tech Campus Eindhoven. One of the keynotes will be by Lightwave Logic CEO Dr. Michael Lebby. His main message: “Photonic Integrated Circuits are Enabling Innovative Products.”
Dr. Lebby will provide an overview of the data communications environment and the latest results of polymer PICs that can scale using 50Gbps modulators for 400Gbps applications. His company, Lightwave Logic, is a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications.
The 3rd Annual Photonic Integration Conference is a technical conference that focuses only on PIC based technologies and attracts speakers and companies from all over the world and is attended by senior stakeholders in the integrated photonics value-chain.
Dr. Lebby’s invited talk is based on a previously published abstract is entitled, “PICs are Enabling Innovative Products.” The talk will focus on the explosive growth of integrated photonics both in data centers, telecom networks as well as non-communications applications and will highlight the tremendous market opportunity that lies ahead for both new polymer-based PIC technologies, as well as incumbent technologies such as Indium Phosphide (InP), and platforms such as Silicon Photonics.
Dr. Lebby will discuss Lightwave Logic’s latest results in polymer based PIC technology, and specifically, Lightwave’s advancement of its Mach-Zehnder ridge waveguide modulator designs for 25Gbps and 50Gbps using Polymer PIC platform (P2IC™) technology. The company’s P2IC™polymers system is – according to Lightwave Logic – inherently scalable, electrically efficient and offers an open chemistry development platform that can generate new materials to increase performance without significant incremental cost. The 50Gbs ridge waveguide is the company’s initial foray into Datacom and Telecom and Cloud Computing markets. However, future plans will incorporate P2IC™polymers in ultra-miniaturized silicon organic hybrid devices.
