May 16, 2025
EINDHOVEN, The Netherlands – FononTech, the company behind Impulse PrintingTM, a breakthrough 3D integration solution for AI capable and miniaturized consumer electronics, is pleased to announce the closing of an €8.5 million ($9.5 million) seed investment.
The round was led by renowned investor Sake Bosch with participation from Innovation Industries, Brabant Development Agency (BOM), TNO, SHIFT Invest, and grant funding from EIC Accelerator.
Photo credit: FononTech
FononTech’s proprietary Impulse PrintingTM technology is the fastest and most cost-effective solution for 3D interconnects in the semiconductor packaging industry - a critical enabler for edge AI devices. These funds are being used to finalize the first product and develop traction with customers. To scale quickly with in-house production, FononTech expects to close a new round later this year.
Photo credit: FononTech
CEO and Co-founder, Rob Hendriks: “We are very pleased with our investor team as their commitment has enabled us to move quickly and convert market traction into sales. In just 2 years, we successfully delivered our first machine to a major semiconductor company.”
CTO and Co-founder, Fabien Bruning: “It is great to see the customer interest in Impulse Printing™ accelerate so quickly. There are already signs of it being recognized as a key solution to integration and performance challenges, especially in advanced packaging.”
FononTech won a Gerard & Anton Award in 2023.
Sake Bosch: “FononTech is creating a new equipment category, not only in semiconductors, but also in the display industry. With over 100 years of experience in the leadership team and sales potential of €1 billion within 5 years, we have exciting times ahead”
Founded in 2023 as a spin-off from Dutch technology organization TNO Holst Centre, FononTech is based in Eindhoven, The Netherlands, and has sales offices in South Korea, Japan and North America. With an extensive patent portfolio and a clear vision, the company is reshaping the future of electronics manufacturing by addressing the growing demand for compact, AI-capable devices.